Speaker
Mr
qing teng
(Huazhong University of Science and Technology)
Description
In this work, diffusion bonding between Aluminum and Copper were successfully performed by hot isostatic pressing (HIP). In order to improve the strength of diffusion bonding joint, different thickness of pure Nickel foils was used as an intermediate layer. The microstructure of the interface between Aluminum and Copper was investigated using X-ray diffraction (XRD) technique, secondary electron microscopy (SEM), and the mechanical property evacuated through nanoindentation test.
| Please choose topic | HIP Process |
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Primary author
Mr
qing teng
(Huazhong University of Science and Technology)
Co-authors
Mr
Chao Cai
(Huazhong University of Science and Technology)
Mr
pengju xue
(Huazhong University of Science and Technology)
Mr
qingsong wei
(Huazhong University of Science and Technology)
Mr
yusheng shi
(Huazhong University of Science and Technology)
